Sputtering Coating Machine for High-Performance Metal Deposition

• Customization: Available
• Warranty: One Year
• Coating: Vacuum Coating
• Substrate: Steel
• Certification: CE, ISO
• Condition: New
• Transport Package: Wooden Case
• Specification: Customized
• Trademark: ACME
• Origin: China
• Production Capacity: 5000

Product Description

Product Description

This coating system is a circular vacuum chamber structure, with exhaust at the rear and a front door structure, and is made of high-quality austenitic stainless steel. One (two) 2-inch (or 3-inch) magnetron sputtering targets are installed on the top plate of the sputtering deposition chamber. The direction of the outgoing beam is toward the substrate rack and a thin film is obtained on the substrate. The equipment has a simple structure and can be used to research and develop nano-scale single-layer and multi-layer functional films, such as hard films, metal films, semiconductor films, dielectric films, composite films, ferromagnetic films, magnetic films and other new thin film materials. .

Main parameters of the system

l Ultimate vacuum degree: ≤6×10-5Pa (obtained within 12 hours under cleaning + baking and degassing conditions);

l Vacuuming time: within 30 minutes, ≤6×10-4Pa;

l Substrate heating temperature: ≤600ºC;

l Substrate size: ≤Φ3inch wafer;

l Number of substrate racks: 1 set;

l Target size: 50mm diameter (optional 3inch);

l Number of targets: 1 or 2;

l Vacuum chamber size: DN250*340 (may be adjusted appropriately according to actual conditions);

l Substrate rack moving distance: ≤50mm (axial direction);

l Angle between target axis and substrate rotation axis: co-sputtering;

l Gas system: 2-way air intake, 1 of which is used for exhaust;
 

Item		Specifications and Description
Vacuum Chamber	Sputtering vacuum chamber	DN220*320, the size can be adjusted according to the design requirements, the upper cover can be opened, and the door can be opened
	Ultra-high vacuum throttle valve	DN100, electric control, optional automatic constant pressure function
	Molecular pump	Molecular pump 110L/S or 150L/S
	Mechanical pump	DVR16 rotary vane pump, also serves as pre-pump and fore-stage pump
	Baffle valve	DN25 electromagnetic baffle valve, pre-pump pipeline on-off
	Stop valve	6mm double ferrule interface electric stop valve
	Lighting and baking device	Optional
	Various types of flanges and observation windows	DN16, 35, 63, 100, 150
	Stainless steel pipelines, pipe joints	Various specifications of precision stainless steel pipes, bellows, pipe joints
Vacuum measurement and air intake	Digital composite vacuum gauge	5227 composite vacuum gauge or imported full-range gauge optional
	Metal bare gauge	ZJ52T, ZJ27 metal interface
	Mass flow controller	D07-7B mass flow controller, range 100sccm
	Pipes and connectors	Mixed gas chamber
	Stop valve	6mm double ferrule interface electric stop valve
	Intake and other control interfaces	Pressure regulating valve electric control, feedback available
Sample rack	Rotating substrate rack	Substrate rotation, substrate rack lifting
	Lifting device	Lifting manual adjustment
	Sputtering substrate heating device	≤600ºC Heating device optional
	Temperature control power supply	Japan Shimaden temperature control, PID temperature control
Sputtering system	Magnetic control sputtering target	Integrated sputtering target, optional 2-inch or 3-inch, with baffle
	Sputtering power supply	500W optional DC or RF
	Equipment rack	Integrated layout
	Water and gas system	Including cooling water machine
	Control system	Standard manual, optional touch screen automatic control

Main parameters of the system:
l Ultimate vacuum degree: ≤5×10-5Pa (obtained within 12 hours under cleaning + baking and degassing conditions);

l Vacuuming time: within 40 minutes, ≤5×10-4Pa;

l Substrate heating temperature: ≤600ºC (iodine tungsten lamp heating);

l Substrate size: ≤Φ3inch round wafer;

l Target size: 2 inches or 3 inches;

l Number of targets: 3;

l Vacuum chamber size: 400×400×H380~450 (may be adjusted appropriately according to actual conditions);

l Substrate rack moving distance: ≤50mm (axial direction);

l Angle between target axis and substrate rotation axis: co-sputtering;

l Gas system: 4-way air intake, 1 of which is for exhaust;

This small coating machine has a compact structure and a simple and elegant appearance. It is easy to operate and maintain and has low operating costs. The main unit and the electronic control system of this device adopt an integrated design. The main unit consists of an equipment rack, a pumping system, and a vacuum chamber. The coating process is carried out in the sputtering vacuum chamber; the electronic control part adopts a standard control cabinet, which contains various modular plug-in boxes. The system is powerful and has stable performance.

The basic parameters of the ultra-high vacuum magnetron sputtering coating machine are as follows:

l Ultimate vacuum of coating chamber: ≤6×10-5Pa;

l Pumping time: better than 6×10-4Pa within 30 minutes;

l Vacuum chamber size: 300×300×H350mm, the vacuum chamber is made of stainless steel;

l Target size and quantity: 2 φ50mm permanent magnet targets;

l Target-substrate distance is adjustable (40~100mm, adjusted by target position);

l Substrate rotation: 0~60 rpm adjustable; equipped with heating, can be heated up to 500 degrees;

l Main machine size: about 1100mm long×750mm wide×1650mm high;

l Gas type: 2-way MFC, working gas Ar+reaction gas;

l Film thickness measurement: equipped with a set of quartz crystal film thickness meter and original probe (optional);

l Control system: Touch screen + PLC control is adopted to control the start and stop of pumps, valves, and various output alarms;
 

Main parameters of the system:

l Ultimate vacuum degree: ≤5×10-5Pa (obtained within 12 hours under cleaning + baking and degassing conditions);

l Vacuuming time: within 40 minutes, ≤5×10-4Pa;

l Substrate heating temperature: ≤600ºC (iodine tungsten lamp heating);

l Substrate size: ≤Φ3inch round wafer;

l Target size: 2 inches or 3 inches;

l Number of targets: 4;

l Vacuum chamber size: 500×500×H450 (may be adjusted appropriately according to actual conditions);

l Substrate rack moving distance: ≤50mm (axial direction);

l Angle between target axis and substrate rotation axis: co-sputtering;

l Gas system: 4 air intakes, 1 of which is for exhaust;

   

The basic parameters of the ultra-high vacuum magnetron sputtering coating machine are as follows:

l Ultimate vacuum of coating chamber: ≤6×10-5Pa;

l Pumping time: better than 8×10-4Pa within 30 minutes;

l Vacuum chamber size: 300mm×300mm×H400mm, the vacuum chamber is made of stainless steel and equipped with a glass observation window;

l Target size and quantity: 2 φ50mm permanent magnet targets (integrated);

l Sputtering power supply: 2 500W digital DC sputtering power supplies;

l Pressure control, equipped with film gauge and electric butterfly valve to achieve constant pressure control;

l Horizontal moving distance 0~80mm, equipped with isolation plate to avoid slag falling during movement;

l Hot pressing system: lower substrate heating temperature: 0~600ºC continuously adjustable. The upper plate is pneumatically controlled to press down;

l Main unit size: length 1060mm×width 600mm×height 1600mm; (the size will be adjusted appropriately according to needs)

l Gas type: 2-way mass flow controller, 2-way air intake;

Company Profile

Our company can provide customers with diversified vacuum coating system design solutions, which can flexibly achieve co-sputtering deposition, multi-layer film deposition, insulating films, and compound film preparation, meeting the requirements of film preparation in various fields. The developed multifunctional evaporation coating machine is widely used in the research and development of OLED and OPV products. On the basis of standard configuration, our company can customize coating machines for specific purposes, portable coating instruments, testing instruments, and non-standard vacuum products according to customer needs.

 

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